· Integration of 3-generation automatic wiring algorithm into single tool
Gridded ~ Shape-based ~ Topology-based
· High wire connection rate
· "Ultra" high speed processing
· Covers 2 steps of planning and detailed wiring
· High throughput design iteration / workflow realized
· Practical [= High precision / quick] Design feasibility
Study / Assessment
· LPB (LSI ~ Package ~ Board) Cooperative Design Increase efficiency of process, shorten period
· Arbitrary angle wiring
Multilayer wiring
· Via generation
· Consideration of Power / GND
· Net Assign / Pin Swap
· Differential pair
· Bundling (net group, bus, bank, ...)
Route control
· Concurrent design (same die / simultaneous progression of multiple package types)
