JF Microtechnology offers a range of test sockets for various lead / leadless packages that emphasize OEE (equipment overall efficiency) in IC / LSI production. It adopts its own contact pin and housing structure and covers a wide range from evaluation to mass production such as high current / Kelvin test and high frequency analog […]
LitePoint’s innovative products for manufacturing were built for just that…the rigors and unique demands of testing complex wireless devices at high volumes in manufacturing. Delays cost time and time costs money. From rugged, battle-proven hardware, to software with easy-to-read results display and logging, LitePoint systems are designed from the ground up for high-volume production.IQxel Family（Test Solutions for Manufacturing） […]
LitePoint’s innovative products for manufacturing were built for just that…the rigors and unique demands of testing complex wireless devices at high volumes in manufacturing. Delays cost time and time costs money. From rugged, battle-proven hardware, to software with easy-to-read results display and logging, LitePoint systems are designed from the ground up for high-volume production.
At-Speed Protocol Verification of Display Packet Transmissions Running on MIPI Physical LayersHighly sophisticated capture and analysis tools are embedded within the Introspect ESP Software and operated on the SV3C CPRX C-PHY Analyzer. The tools enable gaining insight into frame transmissions, DCS commands, and display panel configuration. Frame viewer provides a global view of DSI-2 captures […]
While translating ATPG patterns (WGL and STIL formats) is a push-button operation using Solstice-TDS, converting Verilog simulation output (VCD and EVCD) to a tester format involves a process called cyclization. This process creates cycle-based timing from the event-based VCD/EVCD file. With Solstice TimeTable, signals, directions, test period, per-pin timing, and ATE format are all automatically […]
JF Microtechnology offers a range of test sockets for various lead / leadless packages that emphasize OEE (equipment overall efficiency) in IC / LSI production. It adopts its own contact pin and housing structure and covers a wide range from evaluation to mass production such as high current / Kelvin test and high frequency analog […]
